Can UF CA55 Replace AVX TCN? 35V Polymer Tantalum Cross-Reference Guide

For AI Server, Memory Module & Storage applications, demand is growing fast for a specific set of AVX TCN polymer tantalum capacitors, and these parts have been on long delivery times across the market. When these parts are hard to get, it can stop lines already built on the AVX TCN series.

We have these parts as drop-in replacements. UF Capacitors CA55 Series replaces them directly — with better price and shorter L/T (lead time) — and no board redesign. The cross-reference below shows the CA55 part that matches each AVX part.

 

AVX TCN Parts That Are Hard to Get

 

Customers building AI servers, memory modules and storage systems are specifying these polymer tantalum capacitors — and these are the parts that are hard to get from AVX / KEMET right now:

1. polymer tantalum cap 100μF 35V ±20% Size:7360-20 T&R RoHS — AVX TCN8107M035R0100E
2. polymer tantalum cap 68μF 35V ±20% Size:7343-20 T&R RoHS — AVX TCNY686M035R0100E
3. polymer tantalum cap 47μF 35V ±20% Size:7343-15 T&R RoHS — AVX TCNZ476M035R0100E

UF Capacitors CA55 Series covers all three as direct replacements — same voltage, same capacitance, same EIA footprint.

 

UF Capacitors CA55 — Pin-to-Pin Cross-Reference

 

Our CA55 part replaces each hard-to-get AVX / KEMET TCN part. All three are 35V, ±20% tolerance, same case footprint — use it when your design uses the AVX part and you need a second source that fits.

Photo	UF Capacitors Pin-to-Pin Description	UF Capacitors P/N	Brand	AVX P/N
	CA55 100μF 35V ±20%, Size 7360-20	CA55T107M0035000FR101	AVX	TCN8107M035R0100E
	CA55 68μF 35V ±20%, Size 7343-20	CA55T686M0035000HR101	AVX	TCNY686M035R0100E
	CA55 47μF 35V ±20%, Size 7343-15	CA55T476M003500HR101	AVX	TCNZ476M035R0100E

 

 

CA55 Series — Polymer Tantalum Chip Capacitor

 

The CA55 is the UF Capacitors polymer tantalum chip capacitor made to fit the AVX TCN footprint. It uses a conductive polymer in seven standard surface-mount sizes, on the same board pads as the AVX TCN parts. Main specs:

  1.Capacitance range: 0.68μF to 1000μF (at 100 Hz)

  2.Voltage: 2.5V to 63V

  3.Capacitance tolerance: ±20% (M); K (±10%) available by request

  4.Temperature range: -55°C to +105°C

  5.DC leak current (DCL): ≤ 0.1 CV

  6.Withstands soldering heat: 3 × 250°C peak, max 5s reflow

  7.Moisture sensitivity level 3 (MSL 3)

  8.RoHS compliant; seven sizes: B / C / H / D / E / V (1210 to 2924)

The conductive polymer gives CA55 low ESR, handles more ripple current, and keeps its capacitance steady across temperatures — the same traits as the AVX TCN parts, so it fits the TCN footprint with no need to re-tune the power circuit.

 

Why Use Polymer Tantalum in AI Servers, Memory & Storage

 

GPU power stages, HBM memory, and SSD backup circuits need high current at low voltage from a steady supply. Polymer tantalum does what MnO2 tantalum cannot: the conductive polymer delivers lower ESR, no aging, no fire risk, and holds its capacitance better at high frequency — just what these circuits need, especially when you cannot redesign the supply every time a big supplier's lead times slip.

On the electrical side, CA55 lines up with the AVX TCN footprint: max ESR (at +25°C, 100 kHz) ranges from 25 to 400 mΩ by size and value, and ripple current goes up to 3000 mA at 25°C. The three cross-referenced values — 47 / 68 / 100μF at 35V — sit right on the GPU power output and the HBM / SSD backup rails that are short now, so a CA55 part fits in as a clean second source.

Table 1 — CA55 Reliability and Test Characteristics

 

Parameter	CA55 Specification
Operating Temperature Range	-55°C to +105°C; max working temperature 125°C (per part listing)
Capacitance Range (at 100 Hz)	0.68μF to 1000μF
Capacitance Tolerance	±20% (M) standard; K (±10%) available by request
DC Leakage Current (DCL)	≤ 0.1 CV, read 5 minutes after power-up
Reflow / Soldering Heat Resistance	3 × 250°C peak, max 5s reflow
Moisture Sensitivity Level	MSL 3 (JEDEC J-STD-033) — applies to all current CA55 part numbers
Derating	Above 85°C ambient, derate to category voltage
RoHS Compliance	Yes — full CA55 family is RoHS compliant

Where CA55 Is Used

 

As an AVX / KEMET TCN polymer-tantalum alternative, CA55 is used on the high-current, low-ESR circuits of AI-server, memory-module and storage systems — the places where the three matched parts are short now:

1. AI Servers & GPU Power Filtering — GPU/TPU power output and main power-stage filtering, where those 35V 47/68/100μF parts are hardest to get.
2. High-Bandwidth Memory (HBM) Modules — HBM memory power and filtering next to the GPU.
3. Enterprise SSDs & Storage Systems — NVMe / enterprise SSD backup power if supply drops so DRAM flushes to NAND on power loss.
4. Data Center & Edge Computing Hardware — rack-level power boards, switches, and edge-AI appliances inside AI-server systems.

In each case, CA55 does local filtering, backup power, or bypass on a high-current low-voltage rail — the same role the AVX TCN family would otherwise fill.

 

Why Buy CA55 From UF Capacitors

 

For AI-server, memory-module and storage builders hurt by AVX / KEMET delivery delays, CA55 direct from UF Capacitors covers these exact parts — at better price and shorter L/T:

1. Better price & shorter L/T — CA55 replaces AVX / KEMET TCN at lower cost with shorter lead time, so big-brand stock does not stall your build.
2. Direct from the factory — UF Capacitors supplies the three cross-reference parts directly.
3. Samples ready — CA55T107M0035000FR101 / CA55T686M0035000HR101 / CA55T476M003500HR101 available for testing now.
4. No PCB redesign — CA55 drops into the AVX TCN footprint; qualification stays on the original layout.
5. Cross-reference capability — established drop-in coverage for AVX TCN / TPM and other big-brand tantalum lines.
6. Engineering support — qualification, PPAP, and design-in help; custom case / voltage / capacitance on request.

If you are qualifying an AVX TCN alternative for an AI-server, memory-module or storage BOM, UF Capacitors' engineering team does this cross-reference all the time.

 

FAQ

 

Q: What is the AVX TCN alternative for AI server, memory-module and storage polymer tantalum capacitors?

A: UF Capacitors CA55 Series polymer-tantalum chip capacitors are the drop-in alternative for the three most-requested AVX TCN parts in these designs: 100μF / 35V (TCN8107M035R0100E → CA55T107M0035000FR101), 68μF / 35V (TCNY686M035R0100E → CA55T686M0035000HR101), and 47μF / 35V (TCNZ476M035R0100E → CA55T476M003500HR101). All three are 35V, ±20%, same EIA footprint — a direct replacement while big brands are short.

 

Q: Why are these 35V 47/68/100μF parts short, and how many does one AI server use?

A: AI servers are 'tantalum hungry': a single NVIDIA H100 GPU uses roughly 37 tantalum capacitors, a GB200 system about 3,000 per unit, and a next-gen GB300 rack at least 5,000 — across power boards, switches, and mainboards. ASIC/TPU servers use even more. The 35V 47 / 68 / 100μF polymer tantalum parts sit on the GPU power output and HBM / SSD backup rails, so AVX / KEMET supply is tightest there. CA55 targets exactly those rails.

 

Q: Does CA55 drop in for AVX TCN8107 / TCNY686 / TCNZ476?

A: Yes. For the 100μF / 35V, 68μF / 35V, and 47μF / 35V AVX TCN parts above, UF Capacitors supplies CA55T107M0035000FR101, CA55T686M0035000HR101, and CA55T476M003500HR101 with the same voltage, capacitance, EIA case, and ESR class — no board redesign, no need to re-test the rest of the circuit.

 

Q: How do price and lead time compare with AVX / KEMET?

A: CA55 costs less and ships faster. Because UF Capacitors supplies the three cross-reference parts directly from the factory, you can qualify it without waiting for AVX / KEMET stock. Exact price and L/T are confirmed per volume with the engineering team.

 

Q: Are CA55 samples available for testing?

A: Yes — samples of the three cross-reference parts are ready for testing. UF Capacitors ships CA55T107M0035000FR101, CA55T686M0035000HR101, and CA55T476M003500HR101 for customer qualification on AI-server, memory-module and storage designs.

 

Q: What is a polymer tantalum capacitor?

A: It is a solid tantalum chip capacitor that uses conductive polymer instead of manganese dioxide for its cathode. That swap gives it lower ESR, better high-frequency capacitance retention, no aging behavior, and no fire risk. The UF Capacitors CA55 and the AVX TCN it replaces both use this construction.

 

Q: How is CA55 (polymer tantalum) different from CA45 (MnO2 chip tantalum)?

A: CA45 uses a manganese-dioxide cathode and is UF Capacitors' standard chip-tantalum line; CA55 swaps that for a conductive polymer, giving much lower ESR, no MnO2 aging, no fire risk, and improving ripple-current handling. For AI-server, memory-module and storage rails pushing high current and tight ESR targets, CA55 is the recommended starting point.

 

If you and your customer are building AI servers, memory modules, or storage systems — and AVX / KEMET supply is slowing you down — let's talk. CA55 samples are ready for testing. Contact  at karin@ufcapacitors.com for the cross-reference sheet and sample request.